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  1. CLC 15-150 A/B

    A two component, heat cure epoxy system specifically developed for use on instrument and power transformers. The cured material exhibits excellent thermal stability and thermal cycling endurance. Product meets UL 94-HB flammability requirements. CLC 15-150 A/B

  2. CLC 16-228

    A two component, room temperature cure patching and sealing compound. This product has excellent adhesion to plastics and various metals. CLC 16-228

  3. CLC 16-320

    High strength. A two part, five minute epoxy with high strength for quick repair applications. CLC 16-320

  4. CLC 16-600

    RT Cure, 5 Minute adhesive. Clear when cured, good for quick repairs. CLC 16-600

  5. CLR 1020 / CLH 6021

    Semi-flexible epoxy adhesive and casting system. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. CLR 1020 / CLH 6021

  6. CLR 1026 / CLH 6021

    Low viscosity, semi-flexible. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. CLR 1026 / CLH 6021

  7. CLR 1066 / CLH 6930

    Large mass casting, 30-minute pot life. Masses larger than 6Lbs. A two component, filled, room temperature cure epoxy system.the product has a low exotherm and low shrinkage, making it suitable for castings larger than 3 kgs. CLR 1066 / CLH 6930

  8. CLR 1180 / CLH 6020

    A low viscosity, two component, unfilled, room temperature cure, epoxy system. This system provides resiliency and strength making it suitable for a variety of applications. ie. adhesives, castings, coatings and tooling. CLR 1180 / CLH 6020

  9. CLR 1190 / CLH 6025

    General purpose variable substrate adhesive. A medium viscosity, unfilled casting system. It is suitable for large mass castings and exhibits good impact resistance. CLR 1190 / CLH 6025

  10. CLR 1190 / CLH 6140

    General purpose variable substrate adhesive. A two component room temperature curing epoxy system. Product is suitable for potting, adhesive, and coating applications. Product meets the food and drug administration (FDA) regulations permitting use in food contact applications. CLR 1190 / CLH 6140

  11. CLR 1190 / CLH 6560

    Low viscosity, RT cure. Impact resistant. Excellent thermal cycle. An exceptionally tough epoxy casting system with excellent low temperature thermal and mechanical shock resistance. CLR 1190 / CLH 6560

  12. CLR 1205 / CLH 6770

    Clear low viscosity semi-flexible adhesive / sealant. A low viscosity, two component unfilled, room temperature cure epoxy system. CLR 1205 / CLH 6770

  13. CLR 1396 / CLH 6930

    Extremely strong adhesive. Remains strong at elevated temperatures. A high performance, room temperature curing, 100% solids, epoxy adhesive. This product bonds to a wide variety of substrates and was specifically developed to seal porous metal substrates. CLR 1396 / CLH 6930

  14. CLR 1415 / CLH 6220

    Low Density, Flame Retardant, 120°C Operating. A two component, low density, room temperature curing, flame retardant, epoxy potting/casting compound. CLR 1415 / CLH 6220

  15. CLR 1510 / CLH 6580

    Low viscosity, RT cure. Excellent thermal shock resistance. A low viscosity adhesive with excellent thermal and mechanical shock resistance. CLR 1510 / CLH 6580

  16. CLR 1583 / CLH 6229

    Excellent for potting thermostats and sensors. A two component, room temperature cure, potting and encapsulating epoxy system. Material contains non-abrasive fillers suitable for machine dispense. CLR 1583 / CLH 6229

  17. CLR 1796 / CLH 6580

    UL 94-V0 system for potting and casting small electronic parts that require thermal shock and thermal cycling performance. A two component, low viscosity, room temperature cure epoxy system. Material has yellow card UL94-V0 rating, and contains non abrasive fillers suitable for meter mix dispense. CLR 1796 / CLH 6580

  18. CLR 1946 / CLH 6500

    Product is recommended for potting and encapsulating applications. A two component, room temperature cure semi-flexible epoxy system. The system was developed for potting / casting of electrical and electronic components. Its use of non abrasive fillers and convenient 1:1 ratio by volume, makes it ideal for use in machine dispensing equipment. CLR 1946 / CLH 6500

  19. CLS 9420

    Structural Adhesive. This compound gels quickly at elevated temperatures with excellent adhesion to most substrates. A single component structural adhesive. This compound gels quickly at elevated temperatures with excellent adhesion to most substrates. CLS 9420

  20. XR 11483 / CLH 6260

    Excellent fuel resistance. Suitable for automotive fuel sensors. A two component, chemical resistant epoxy casting system. The cured product has improved thermal conductivity for applications where heat dissipation from thermally sensitive devices is required. Cured product is resistant to Ethanol, Gasoline, and Diesel, when exposed to these chemicals at ambient or elevated temperatures. XR 11483 / CLH 6260

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